Endicott Interconnect Technologies, Inc. Appoints Director of Engineering

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.

Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.

“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”

Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.