Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development

Endicott Interconnect Technologies, Inc. has announced the appointment of Rajinder Rai as Vice President, Research & Development reporting to Voya Markovich, effective immediately. He will assume responsibility for the management of resources and support functions for current and future R&D activities in response to business opportunities with state and federal program agencies.

Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.

Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.

“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”