Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure

Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.

Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.

Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.

“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.

Warren is based in Louisville, Kentucky where he lives with his wife and two children.