Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. today announced a job fair scheduled for Saturday, February 3rd from 9am to 1pm at Huron Campus Reception in Endicott, NY. Professional, full-time manufacturing and supplemental manufacturing opportunities are available.

“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.

EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.

Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.