Complex PC board assemblies from Endicott Interconnect Technologies, Inc. (EI) are providing solutions for customers who face special challenges as they stretch the boundaries of traditional PCB performance. EI is developing new materials, processes and interconnect strategies that help to advance technologies and provide solutions for customer requirements in defense, aerospace, medical, computing/IT infrastructure and advanced test equipment applications.
Endicott Interconnect is a fully integrated provider of advanced electronic solutions. “When you look at a complex PC board assembly, you see the end result,” said Rex Green, Product Manager of EI’s Complex Assembly Operations. “What you don’t see are the many steps leading up to it, such as R&D, design, engineering, materials development, and substrate and board fabrication. What differentiates EI is that we perform all of those and then add system integration and testing to the mix.”
EI provides a wide range of assembly capabilities, including high density, double sided, hybrid PC board assemblies (SMT/PTH/press fit) with high component counts, high-I/O area array modules (CGA, LGA, PBGA), and dense, high-I/O connectors for very complex, compute-intensive applications. And, once the assembly is complete, EI designs and executes strategies for a wide range of analog, digital, power supply and JTAG testing.
EI can handle virtually any form factor, from <1 inch square to 6 feet square, and nearly any component placement solution – all in a high-mix production environment with line-to-line repeatability, quick change feeder systems and solder volume, X-ray and AOI process controls. “Strategic Life Cycle Management initiatives such as flexible scheduling, in-plant component inventory, customer parts consignment, just-in-time delivery and turnkey manufacturing allow us to offer a number of creative options for mitigating risk, reducing cost and supporting quick turn-around,” said Mike Hills, Senior VP of Sales, Marketing & Business Development. “The results are solutions shaped to each customer’s particular needs.” EI tailors its capabilities to best suit individual application requirements. For instance, EI used its expertise in metallurgy, materials and unique processes to create a reliable and repeatable volume manufacturing process for the electronic content of an intravascular ultrasound catheter. For a massive special-purpose supercomputer, EI utilized its know-how with interconnect devices to resolve problems with the customer’s printed circuit interconnect strategy and ended up building and hosting the machine. For a next-generation military voice and data communications application, EI’s CoreEZ® technology facilitated reduction of the electronic assembly to 2.20” x 2.20” from 7.75” x 15.00” while increasing functionality of the equipment.