ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.
The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.
“This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.