Endicott Interconnect Printed Circuit Board Build Highlights

We will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build. Here is our first highlight:

  • 20 layers
  • 9.2 x 6.6“
  • 86 mils thick
  • Tolerance: +8.6/-8.6 mils
  • Material: Megtron 6
  • ENIG surface finish
  • 12 layer core with mechanically drilled through holes
  • 4 layers of microvias on each side of the core
  • Laser drilled and copper plated uvias
  • Via structures tested using CITC testing (Current Induced Thermal Cycling)
  • CITC conducted from room temperature to 220 C
  • 5mil Stacked or unstacked microvias unbreakable through 250 cycles!
  • Stack up Report

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5mil Stacked or unstacked microvias unbreakable through 250 cycles!

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Stack up Report

For more information on our PCB capabilities follow this link. If you have any questions fill out our contact us form.