Endicott Interconnect Technologies announced it was awarded $101 million in Defense Department contracts in 2010 and this year to date.
EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010.
This year, EI was awarded two hardware sustainment contracts, valued at $2.1 million and $9.5 million. The latter is a 10-year contract, the company said.
Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronic packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.
“This is a significant step forward in the next generation of high-performance computing and utilizes some of the most advanced electronic packaging solutions available in industry today,” said Eric Hills, vice president — business development/program office at EI. “EI had managed the program from the system’s design and development phase through prototype and pre-production and is very excited to begin full production.”
EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets.