Endicott Interconnect’s Dr. Rabindra Das recently presented several papers at the 62nd Electronic Components and Technology Conference in San Diego, California.
Dr. Das presented his findings on the following topics:
Fabrication and Electrical Characterization of Embedded Actives and Passives for System Level Analysis: Towards Size, Power and Weight (SWAP) Reduction
3D-Interconnect Approach for High End Electronics
Nano-Micro Particle Filled Thermal Interface Materials: Towards Materials Development, Characterization, and Assembly Performance Evaluation
To access the complete white papers click here. For for information on Endicott Interconnect, visit our website or fill out a contact us form.