EI’s Dr. Rabindra Das Presents at ECTC 2012

Endicott Interconnect’s Dr. Rabindra Das recently presented several papers at the 62nd Electronic Components and Technology Conference in San Diego, California.

Dr. Das presented his findings on the following topics:

Fabrication and Electrical Characterization of Embedded Actives and Passives for System Level Analysis: Towards Size, Power and Weight (SWAP) Reduction

3D-Interconnect Approach for High End Electronics

Nano-Micro Particle Filled Thermal Interface Materials: Towards Materials Development, Characterization, and Assembly Performance Evaluation

To access the complete white papers click here. For for information on Endicott Interconnect, visit our website or fill out a contact us form.