Endicott Interconnect’s Dr. Rabindra Das recently presented several papers at IMAPS 45th International Symposium On Microelectronics in San Diego, California.
Dr. Das presented his findings on the following topics:
Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration
Rediscovering Multilayer Rigid-Flex with Z-interconnect Technology
Miniaturization of Electronic Substrates for Medical Device Applications
EI’s “Miniaturization of Electronic Substrates for Medical Device Applications” was selected as the best paper of the “Medical Device Packaging” session!
To access the white papers click here. For more information on Endicott Interconnect, visit our website or fill out a contact us form.