Endicott Interconnect Now Offering Subcontracting Services

Endicott Interconnect has been a leader in the PCB and semiconductor package fabrication & assembly business for 45 years. We know what it takes to develop and manufacture superior, high quality products.

Our subcontracting services include:

  • Solderable Surface/ Wirebondable Finish Offerings
  • Universal Metal Surface Finish
  • Immersion Ag For Solderable Surface
  • High Temp/ Multiple Reflow Resistant OSP
  • Alternative Oxide Processing
  • Copper Plating
  • PTH Drilling/ Via Formation
  • Autoclave
  • Buried Resistor Trimming
  • And much more