Endicott Interconnect Printed Circuit Board Build Highlight

We will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build. Here is our second highlight:

  • 72 Layers
  • Conductive paste
  • 4 subs
  • Megtron 4
  • 397 mils thick
  • Silica holefill
  • 3 mil line widths
  • Impedance controlled
  • ENEPIG surface finish
  • Soldermask