Endicott Interconnect Technologies, Inc., (EI) was presented with a “ROG” Award for the “Most Challenging Board Build” by the Rogers Corporation. EI was recognized at a dinner during IMS 2012 on Wednesday, June 20th in Montreal, where Senior R&D Scientist, Mark Schadt, accepted the award on EI’s behalf.
The “ROG” award was presented in recognition of Endicott Interconnect’s exceptional contributions in developing and fabricating a challenging Printed Circuit Board, using Rogers Corporation’s LCP material. “We applaud Rogers Corporation for their commitment to provide both consistent material quality and knowledgeable support, and wish to express our sincere appreciation for being recognized by them for our successful fabrication of high-reliability, multilayer circuits incorporating Rogers Ultralam® 3000 LCP dielectric,” stated Mr. Schadt.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., (EI) with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.