Endicott Interconnect Technologies will be exhibiting (booth #6) at this year’s IMAPS Conference and Exhibition on Device Packaging, set to be held from March12-14 in Scottsdale, Arizona.
EI’s Dr. Rabindra Das will be presenting three papers at the conference
“3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics” on Tuesday March 12th at 2:30 PM
“Versatile Z-Axis Interconnection for High Performance Electronics” on Wednesday March 13th at 11:00 AM
“Advanced Microelectronics Packaging Solutions for Miniaturized Medical Devices” on Thursday March 14th at 11:15 AM