Endicott Interconnect to Exhibit At Multiple Tradeshows In May

Endicott Interconnect Technologies plans to exhibit at three trade shows in the month of May, including:

2013 IMAPS Workshop on Packaging the Next Generation of Nano Devices in Albany, NY (4/30-5/1)

IMAPS New England Chapter’s 40th Annual Symposium and Exposition in Boxborough, MA (5/7)

2013 IMAPS Microelectronic Packaging for Medical & Hi-Rel Devices in Minneapolis, MN (5/13-5/14)

At each show, Endicott Interconnect will be showing off their new technological advancements in the microelectronics industry.