Endicott, NY — Endicott Interconnect Technologies, Inc. (EI) announced today that its System-In-Package technology performed successfully as a key subsystem of Lockheed Martin’s Extended Area Protection and Survivability (EAPS) Program during a test on March 22 at White Sands Missile Range, N.M. EI’s technology acts as the command center of a very small hit-to-kill interceptor designed to defeat rocket, artillery and mortar attacks.
“Endicott Interconnect’s System-In-Package Technology is a significant enabling technology for clients in a variety of different market segments, in this case Aerospace and Defense. Not only does this size, weight, and power (SWAP) reduction technology fit perfectly into EI’s road-map, but it has the potential to protect and save the lives of thousands of warfighters,” stated Eric Hills, VP of Business Development at EI. Additional tests are set to be conducted in the latter half of 2013.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., (EI) with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, automated test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.