ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Current Induced Thermal Cycling (CITC) test is now an official IPC validated test method with the release of Revision A to IPC-TM-650 Method 2.6.26. i3’s CITC testing, used for Printed Circuit Board (PCB) reliability testing, can be found as Method B in this most recent revision.
i3 will now be making its CITC testers and testing services available for purchase to the market place.
i3’s CITC tester holds many distinct advantages over the industry standard PCB test methods including: smallest possible single net coupon; quick coupon connect/disconnect; controlled heat cycle ramp and dwell for fastest and most accurate cycle at any temperature; “Ultimate CITC” option for starting temps as low as -55C; temperature coefficient of resistance always measured; and typical test results for lot acceptance or reliability verification in less than 2 hours.
“i3 has been using CITC technology to test the reliability of our printed circuit boards for over 20 years. Now that this test method has been validated by IPC we can move forward with our strategy of officially offering this test to the industry”, stated Robert Nead, President at i3 Electronics.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.