i3 Electronics Fabrication Highlight: March 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was designed and manufactured for the medical electronics market.

The Substrate

  • Laminate chip carrier
  • Polyimide material
  • 23 mils thick
  • 8 signal layers, 0 power layers
  • 2 x 1.5 in
  • Combination of blind and buried vias
  • Wirebondable gold surface finish
  • 46E0946_11479589 8 layer-2

Why i3?

The customer came to i3 for this build because of our ability to produce a high reliability, polyimide substrate. i3 has a strong reputation for highly quality substrates for mission-critical applications.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.