i3 Electronics Fabrication Highlight: May 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate and assembled packaged was manufactured for the Aerospace market

The Product

  • HyperBGA
  • 31 mm X 31 mm
  • 9 Layers
  • Specialized Teflon product
  • 3,000 blind vias and plates holes
  • Fully assembled
  • MayPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble complex and mission-critical semiconductor substrates and assembled packages.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.