ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Advanced Laboratory Services business unit has received several high value contracts to perform failure analysis, reliability engineering services, SEM and other analytical work. The contracts are from significant US and international companies in various segments of the electronic packaging industry and run through the first half of 2014.
“Many of our customers are unaware of our Advanced Labs group and the vast services that they provide. Our labs specialize in material and failure analysis as well as reliability engineering, particularly CITC and CAF testing. Our lab services team is a true asset to our customer base and our company,” said Robert Nead President at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.