i3 Electronics, Inc. Awarded $7 Million Contract For HyperBGA Assemblies

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Computing & Hardware firm has awarded the Company a $7 million contract for the supply of i3’s HyperBGA assemblies. The contract will run through Q4 of 2014.

“i3’s HyperBGA technology is a key enabler for many of our customers due to its unique ability for Size, Weight & Power (SWaP) reductions. Coupled with our assembly capabilities, i3 is well positioned to provide our customers with a complete electronic solution that is produced domestically,” said Robert Nead, President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.