ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading RF & Microwave application developer has awarded the Company substantial contracts over the course of Q1 of 2014 for the supply of i3’s HyperBGA substrates for the customer’s RF & Microwave applications.
“i3’s HyperBGA technology is a key enabler for many of our customers due its unique ability for Size, Weight & Power (SWaP) reductions. We are committed to supplying our customers with the highest quality substrates that will enhance their products,” said Robert Nead, President at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.