ENDICOTT, NY— i3 Electronics, Inc. (i3) held a two day business development summit from March 19th through March 20th. The summit brought together key employees from upper management, business development, marketing, supply chain, operations, finance, contracts and engineering to discuss ways to improve customer satisfaction, align company focus to meet customer needs, and increase visibility in the marketplace.
“i3 is dedicated to continually analyzing our business model and looking for ways that we can better support our customer base. Pulling together employees from a variety of different departments allows us to really get on the same page as an organization. We will continue to hold these summits on a quarterly basis,” said Neal Driver, Director of Programs & Business Development at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.