i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity

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ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Telecommunications firm has awarded the Company a substantial contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a satellite application.

“i3’s printed circuit board fabrication capabilities are industry-leading. We are dedicated to providing our customers with the most complex and reliable PCBs on the market.” said Robert Nead President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.