ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has won an opportunity for final system integration work for a high performance, medical, super-computing application. i3 will be responsible for complete wiring, mechanical assembly, and assisting with debug.
“i3 Electronics has the expertise, people and equipment to be a very effective system integrator. Our vertically integrated business model allows us to be a complete solution to our customers. We are very excited to be working on this project,” said Robert Nead, President at i3.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.