i3 Electronics will be exhibiting at IMAPS 10th International Conference and Exhibition on Device Packaging being held March 10-13, 2014 at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ.
i3 will be located in booth #27.
i3′s Kim Blackwell, Director of Engineering, will be presenting the following paper at the show:
“Advanced Organic Substrate Technologies For High Performance, High Reliability Electronic Miniaturization” on 3/11 at 11:00 AM
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.