Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. A new 3D “Package Interposer Package” (PIP) solution is suitable for combining multiple mem-ory, ASICs, stacked die, stacked packaged die, etc., into a single package.
The Future of Microelectronics
The need for functions that were once unachievable due to the size and weight of the assembled electronics package can now be realized because of System-in-Package (SiP). Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications or even to satisfy a multitude of new Industrial needs: System-in-Package is the answer!
The Future of Capacitor Technology
EI’s multilayer embedded capacitor technology, the newest addition to the family of microelectronics packaging product capabilities, offers prototypes suitable for miniaturization with proven reliability and performance. EI has designed and fabricated several embedded capacitor test vehicles using resin coated copper capacitance (RC3) materials.
The medical industry is clearly and urgently in need of the development of advanced packaging that can meet the growing demand for miniaturization, high-speed performance, and flexibility for handheld, portable, in vivo, and implantable devices. To accomplish this, new, smaller packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller die pad pitches, and high reliability.
What is Z-Interconnect?
Z-Axis interconnection is a means of routing circuit traces, within and through the package. EI’s Z-Interconnect technology is used to fabricate electronic packaging components with very high interconnect density and enhanced electrical performance, while maintaining a reasonable cost. Z-Interconnect is perfect for Semiconductor Packaging as well as Printed Circuit Board Fabrication.
Trusted Solutions For High Performance Computing
At Endicott Interconnect we have a proud history of design expertise and technological innovation in the field of high performance computing.
Roll-to-Roll Position Statement
In 2013 EI will add roll-to-roll production capability for single and double sided flex substrates in addition to our current product offering in panels.
“Due to the current and increasing threat of counterfeit electronic components entering the supply chain, Endicott Interconnect has decided to take a leadership role and combat this problem by introducing our proprietary anti-counterfeit and anti-tamper technology.”- Jay McNamara CEO
EI’s Innovative Anti-Counterfeit and Anti-Tamper Technology Adopted by the DOD
• Signature technology for rapid authenticity identification
• RFID for tracking and anti-counterfeiting
• Anti-Tamper package elements and protection
Endicott Interconnect’s Proprietary Anti-Counterfeit & Anti-Tamper Technology (L) Anti-Tamper Package, (M) Password Protected Package, (R) Embedded RFID
We Are a Domestic Supplier
• Category 1A Trusted Integrated Circuit Assembly Supplier for Packaging/Assembly Services from the Department of Defense
• Approved military supplier status by leading prime contractors for mission critical applications
• AS 9100C, ISO 9001, IPC and Nadcap certifications, MIL specs, RoHS compliance and ITAR registration
Endicott Interconnect Is a Leader In:
• Printed circuit board fabrication, assembly and test
• Semiconductor packaging fabrication, assembly and test
• System-in-Package and shrink
• System integration and test
• Advanced laboratory services
• Design, prototype and QTA
EI’s Anti-Counterfeit and Anti-Tamper Applications Will Protect Your Technology!
For more information on EI check out our website or fill out a contact us form.