ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.
In order to build upon Greater Binghamton’s reputation as the premier hub of microelectronic technologies in New York State and utilize the vast existing local and statewide knowledge base, the Research Foundation of State University of New York, with support from Binghamton University and Endicott Interconnect Technologies. Inc., has launched a new collaboration that is expected to greatly accelerate the commercialization of new and improved electronics systems.
The corporation, known as the Binghamton Center for Emerging Technologies (BCET), will work in partnership with commercial, academic, and government agency members, through its New York Systems Integration and Packaging Consortium (NYSIP) to focus on small scale systems integration and packaging projects that could result in a broad range of new commercial and military products.