Die Extraction And Reassembly (DER)

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Original part package, as received.

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Harvested part after extraction process. All package encapsulant has been removed from die face, edges, and back side.

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Resulting pads each have a wire-formed, diamond-lapped, planar bonding surface at a uniform height.


Superior Planar Bonding Surface Process

Planar Bonding Surface Process provides a pristine flat surface, suitable for rebond

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Best for high reliability applications:
✓ No voids or trapped contaminants; die fully planarized
✓ Same surface area as the original ball or wedge bond
✓ Compatible with Al, Cu wedge bond or Au ball bond
✓ Original bond-to-pad interface remains unchanged

Conventional Ball Bond Removal leaves a remnant of the wire

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This will affect long term reliability and performance
✗ Potential for trapped contaminants and non-conformities
✗ Partial surface area contact can increase resistance
✗ Unsuitable for Al wedge bonds

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Planar Bonding Surface


Solving Microelectronic Obsolescence

BENEFITS OF DIE EXTRACTION AND REASSEMBLY FOR OBSOLETE IC REPLACEMENT:

  1. Availability: Commercially-plentiful components can be repackaged and retested to mil-aero conditions
  2. Counterfeit risk mitigation: Determining device authenticity is accomplished during extraction
  3. Repackage for harsh environment: High temperature and vibration survivability may require ceramic packages rather than common plastic packages
  4. Time: Redesigning and qualifying a new design can be a prohibitively lengthy process
  5. Cost: The OCM’s minimum lot charge to manufacture an obsolete product can be prohibitively expensive
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Original part as received

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X-Ray of plastic package to determine lead frame locations and pin-outs to die

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Initial frontside decap run, to observe chemical compatability to die surface and pads

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Higher magnification to confirm pin-out and die revision details


Solder Bump Removal And Die Thinning

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Die are received with solder bumps which need to be removed to allow reuse of the die.

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Bumps removed. Die shown also thinned to desired customer thickness for repackaging.