Electronic Manufacturing Services And Test Solutions

i3 will fabricatate your PCB and then assemble it.

i3 merges engineering, manufacturing, product reliability, and life cycle support into assembly solutions that exceed your expectations — and industry standards.

  • SMT
  • Wave Solder and Selective PTH Solder
  • Press Fit
  • Hand Assembly and Solder
  • LGA
  • BGA/CGA down to 0.04″ (1.0 mm)
  • DCA wirebond and flip chip
  • LGA pitch down to 0.04″ (1.0 mm)
  • uBGA and CSP down to .5 mm pitch
  • Perimeter lead fine pitch to 0.01″ (0.25 mm)
  • SMT discretes and chips
  • Very thick PCBs
  • Double sided, large complex boards with mixed technology
  • Connectors: dense, high I/O connectors
  • High density BGA/area array rework
  • High density hybrid assemblies
  • Components: high I/O area array modules
  • Mechanical: cage, chassis, system assemblies
  • Teredyne 2286, 2287LX
  • Scorpion Flying Probe
  • ESS and Burn-In
  • Ultraprobe
  • Functional System Level


  • Exceptional service delivered on time (99% or better)
  • A wide range of products, from high-end, complex, mission-critical assemblies to simpler support PCB assemblies
  • Full hybrid assembly, backplane, chassis, and system builds
  • Focused NPI to production launch, with support from dedicated program managers and engineers.

Contact Us today to let i3 assemble your most complex products