Electronic Manufacturing Services And Test Solutions

i3 will fabricatate your PCB and then assemble it.

i3 merges engineering, manufacturing, product reliability, and life cycle support into assembly solutions that exceed your expectations — and industry standards.

  • SMT
  • Wave Solder and Selective PTH Solder
  • Press Fit
  • Hand Assembly and Solder
  • LGA
  • BGA/CGA down to 0.04″ (1.0 mm)
  • DCA wirebond and flip chip
  • LGA pitch down to 0.04″ (1.0 mm)
  • uBGA and CSP down to .5 mm pitch
  • Perimeter lead fine pitch to 0.01″ (0.25 mm)
  • SMT discretes and chips
  • Very thick PCBs
  • Double sided, large complex boards with mixed technology
  • Connectors: dense, high I/O connectors
  • High density BGA/area array rework
  • High density hybrid assemblies
  • Components: high I/O area array modules
  • Mechanical: cage, chassis, system assemblies
  • Teredyne 2286, 2287LX
  • Scorpion Flying Probe
  • ESS and Burn-In
  • Ultraprobe
  • Functional System Level

Features

  • Exceptional service delivered on time (99% or better)
  • A wide range of products, from high-end, complex, mission-critical assemblies to simpler support PCB assemblies
  • Full hybrid assembly, backplane, chassis, and system builds
  • Focused NPI to production launch, with support from dedicated program managers and engineers.

Contact Us today to let i3 assemble your most complex products


SMT

Capabilities & Equipment Overview

  • Fully automated assembly line
  • Big board capabilities
  • Fine pitch placement (≤.4mm)
  • Package placement
3-1

Package Placement

3-3

Fully Automated, State-of-the-Art SMT Line

3-2

Fine Pitch Placement

3-4

High Performance Line Feeders


Through Hole

Capabilities & Equipment Overview

  • Sequencing
  • DIP, Axial and Radial Insertion
  • Rigid, rigid flex and flexible assemblies
4-1

Through Hole PCBA

4-3

Through Hole Equipment

4-2

Rigid Through Hole Assembly

4-4

Through Hole Equipment


Wave Solder

Capabilities & Equipment Overview

  • Selective wave soldering
  • Hand solder processing
  • Lead and lead-free wave solder
5-2

PB & PB-Free Wave Solder Equipment

5-1

Wave Soldered PCBA

5-3

Advanced Lead-Free Wave Soldered Assembly


System Level Assembly

Capabilities & Equipment Overview

  • Box build
  • System integration
  • Complete design services, functional testing, depot/ repair
6-2

Workforce Management System

6-4

i3 Custom-Designed Harness. Test Plan and Test Report Provided To Customer

6-3

System Integration

6-1

i3 Designed and Manufactured PCB Reliability Test System


Test Development

Capabilities & Equipment Overview

  • ICT
  • FCT
  • ESS
7-3

Functional ICT Fixture

7-1

Automated Functional Test

7-2

Flying Probe Test

7-4

RF Test Rack


Failure Analysis

Capabilities & Equipment Overview

  • Reliability engineering labs
  • Accelerated life testing
  • Humidity testing
  • Material science & failure analysis
8-1

Materials Science

8-2

Contamination Identification

8-3

Testing For Electrical Opens

8-4

Accelerated Life Testing Chambers