ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company a contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a military application, using advanced resistor material.
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ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Current Induced Thermal Cycling (CITC) test is now an official IPC validated test method with the release of Revision A to IPC-TM-650 Method 2.6.26. i3’s CITC testing, used for Printed Circuit Board (PCB) reliability testing, can be found as Method B in this most recent revision.
ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Telecommunications firm has awarded the Company a substantial contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a satellite application.
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ENDICOTT, NY – i3 Electronics, Inc announced today that it has received a commitment from IBM to purchase the company’s Current Induced Thermal Cycling (CITC) Testers for in-house PCB reliability testing. Delivery of the machines is scheduled for the second half of 2014.
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ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has made its Current Induced Thermal Cycling (CITC) testers and testing services available for purchase. i3’s CITC testing can be found as Method B in the upcoming release of IPC-TM-650-2.6.26A.
We are living in a high-tech world. Everyday technology is advancing and evolving at a rate that has been unmatched in human history. Tech companies are looking for suppliers who can give them a distinct edge in the proverbial technology “space race”. We truly believe that our company has the technology and know-how to provide that “x-factor” for our customers. Our name might not be well known, but our technology is world-class.
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ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has won an opportunity for final system integration work for a high performance, medical, super-computing application. i3 will be responsible for complete wiring, mechanical assembly, and assisting with debug.
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ENDICOTT, NY— i3 Electronics, Inc. (i3) held a two day business development summit from March 19th through March 20th. The summit brought together key employees from upper management, business development, marketing, supply chain, operations, finance, contracts and engineering to discuss ways to improve customer satisfaction, align company focus to meet customer needs, and increase visibility in the marketplace.
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ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has won a new Printed Circuit Board (PCB), Quick Turnaround (QTA) opportunity from a multinational semiconductor and communications company. i3’s PCB QTA operation will manufacture the PCBs, which contain micro vias and multiple subs, in only 15 days.
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i3 Electronics will be exhibiting at IMAPS 10th International Conference and Exhibition on Device Packaging being held March 10-13, 2014 at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ.