Military
Electronic Solutions You Can Count On
Reliability is the key. Lives are at stake. Your products cannot fail. i3 Assembly’s dedication to high quality and reliable electronic solutions will ensure your products work each and every time.
From prototype to volume assembly, i3 Assembly will meet and exceed your exact requirements for mission-critical equipment in the following areas:
- Combat Vehicles
- Avionics and Controls
- Space and Airborne Applications
- Electronic Warfare
- Sensor Systems
- Network Centric Systems
- C4ISR
- Unmanned Systems
- RF Applications
- Homeland Security
- Anti-Counterfeiting & Anti-Tamper Technologies
- Intelligence & Surveillance Systems
Our products meet the needs of high performance applications where speed, reliability, and increased signal I/O are critical. In particular, our System-in-Package (SiP) technology is a key enabler for our A&D customers due to its ability for Size, Weight and Power (SWaP) reductions. Using SiP our customers have achieved significant cost savings without sacrificing functionality.
i3 Assembly can support design, manufacture and test of all our products at our North American facility, providing rapid turnaround in a completely secure environment.
Platform Experience:
ACDS POD
ALQ-114
AMPV
Armored Knight
ASLAV
AS-N128
Automated RX Dispenser
BAMDS
Beam Imaging
BFT
Bradley
Brand C
Bronco
CBPS
CDL
Check 6
CIRCM
CLRF
CMOP
Compass Call
CREW 2x, 3x
CROSSHAIRS
DIRCM
Dragon Runner
E-130H
Early Warn Missle
EQ36
F35
FBCB2
FMTV
FQE-IFF
GMR
GMV
High Low QE
Honda Jet
IDECM
INOD
Int Space Station Docking
ITT CREW 2.1
JBC-P
JCAD
JDAM
JETS-TLDS
JLTV
KU Band
L-ATV
LCMR
LINK 16 Radio
UH60R FLIR
LRAS
M109
M113
M1-Abrams
MAARS
M-ATV
MRFS
MIDS
MMS-P
MPF
MTS
Nett Warrior
NIE Eforts
Owl
Paladin
Patriot
Rover
SATCOM
SBIRS
SLQ-32
SPAWAR
SQQ32
Stryker
TALON
TCDL
TFAS
Towed Mortar Weapon
UAV Analytical Labs
UEWR
VITROS
VSAT Terminals
Mission Objective
A key subcontractor supporting the Department of Defense needed high performance semiconductor packaging for an advanced computing application in a highly secure program.
Solution
i3’s high performance semiconductor packaging was selected. i3’s ability to provide a vertically integrated solution led to being awarded the module assemblies, PCBs, functionally tested PCB assemblies and engineering services to support this program.