Publications
Papers
Design and Simulation Flow for Highly Integrated, Heterogeneous Packaging Solutions
GOMAC - 2021
- Introduction
- HSIP Process Overview
- Integrated IC/Package Design Methodology
- Package Design Process
- SoC and Package Testing
- Future Work
- Conclusion
Heterogeneous System-In-Package (HSIP) Technology
IMAPS - 2020
- An Introduction
- Test Vehicle Design
- HSIP Module Build
- Results
- Conclusions
- Acknowledgements
A HETEROGENEOUS SIP SOLUTION FOR RF APPLICATIONS
GOMAC - 2018
- DARPA ACT TA2 Program (Arrays at Commercial Timescales)
- System architecture which allows a 2D tile-able array of elements, for scalable and reconfigurable phased array that is achieved through vertical integration of heterogeneous devices