Publications

Papers

Design and Simulation Flow for Highly Integrated, Heterogeneous Packaging Solutions

GOMAC - 2021

    • Introduction
    • HSIP Process Overview
    • Integrated IC/Package Design Methodology
    • Package Design Process
    • SoC and Package Testing
    • Future Work
    • Conclusion

Heterogeneous System-In-Package (HSIP) Technology

IMAPS - 2020

    • An Introduction
    • Test Vehicle Design
    • HSIP Module Build
    • Results
    • Conclusions
    • Acknowledgements

A HETEROGENEOUS SIP SOLUTION FOR RF APPLICATIONS

GOMAC - 2018

  • DARPA ACT TA2 Program (Arrays at Commercial Timescales)
  • System architecture which allows a 2D tile-able array of elements, for scalable and reconfigurable phased array that is achieved through vertical integration of heterogeneous devices
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