Die Extraction and Reassembly
Die Extraction and Reassembly (DER)
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Original part package, as received.
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/extraction2.jpg?time=1722038704)
Harvested part after extraction process. All package encapsulant has been removed from die face, edges, and back side.
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/extraction3b.jpg?time=1722038704)
Resulting pads each have a wire-formed, diamond-lapped, planar bonding surface at a uniform height.
Superior Planar Bonding Surface Process
Planar Bonding Surface Process provides a pristine flat surface, suitable for rebond
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/bb2.jpg?time=1722038704)
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Best for high reliability applications:
✓ No voids or trapped contaminants; die fully planarized
✓ Same surface area as the original ball or wedge bond
✓ Compatible with Al, Cu wedge bond or Au ball bond
✓ Original bond-to-pad interface remains unchanged
Conventional Ball Bond Removal leaves a remnant of the wire
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/Picture1.jpg?time=1722038704)
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/Picture2.jpg?time=1722038704)
This will affect long term reliability and performance
✗ Potential for trapped contaminants and non-conformities
✗ Partial surface area contact can increase resistance
✗ Unsuitable for Al wedge bonds
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/bond-surface-diagram.png?time=1722038704)
Planar Bonding Surface
Solving Microelectronic Obsolescence
BENEFITS OF DIE EXTRACTION AND REASSEMBLY FOR OBSOLETE IC REPLACEMENT:
- Availability: Commercially-plentiful components can be repackaged and retested to mil-aero conditions
- Counterfeit risk mitigation: Determining device authenticity is accomplished during extraction
- Repackage for harsh environment: High temperature and vibration survivability may require ceramic packages rather than common plastic packages
- Time: Redesigning and qualifying a new design can be a prohibitively lengthy process
- Cost: The OCM’s minimum lot charge to manufacture an obsolete product can be prohibitively expensive
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2021/03/micro_elec_1.jpg?time=1722038704)
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Original part as received
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/nre2.jpg?time=1722038704)
X-Ray of plastic package to determine lead frame locations and pin-outs to die
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/nre3.jpg?time=1722038704)
Initial frontside decap run, to observe chemical compatability to die surface and pads
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/nre4.jpg?time=1722038704)
Higher magnification to confirm pin-out and die revision details
Solder Bump Removal and Die Thinning
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Die are received with solder bumps which need to be removed to allow reuse of the die.
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/bump2.jpg?time=1722038704)
Bumps removed. Die shown also thinned to desired customer thickness for repackaging.