Advancing solutions in Microelectronic Packaging

Vision

i3’s vision is to be the leading designer and manufacturer of advanced, reliable, and high performance electronic solutions, assemblies and integrated systems.

Mission

It is the mission of i3 Microsystems to design, manufacture, and assemble tomorrow’s custom, mission critical, electronic solutions and systems today.

i3 Microsystems

A Small Business Enterprise

About Us

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Utilizing Fan-Out Wafer Level Packaging (FOWLP) techniques to implement entire systems in a package on the scale of a semiconductor die

Driving the largest reductions in Size, Weight and Power (SWaP) through advancements in Electronic Packaging

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