News &

News & Events

December 16, 2021

Kulicke & Soffa Collaborates with i3 Microsystems to Develop Solutions for Next-Generation Advanced Microelectronics Packaging

October 13, 2021

i3 Microsystems will be on a panel to discuss “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference.

May 20, 2021

i3 Microsystems discusses new technologies in Advanced Packaging with Semiconductor Engineering

March 30, 2021

Draper Awarded $14M by DoD for Trusted Advanced Packaging Capability Expansion with i3 Microsystems as Major Subcontractor

March 24, 2021

Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System

Look for i3 at these Trade Shows and Conferences



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