News &Events News & Events December 16, 2021 Kulicke & Soffa Collaborates with i3 Microsystems to Develop Solutions for Next-Generation Advanced Microelectronics Packaging read now October 13, 2021 i3 Microsystems will be on a panel to discuss “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference. read now May 20, 2021 i3 Microsystems discusses new technologies in Advanced Packaging with Semiconductor Engineering read now March 30, 2021 Draper Awarded $14M by DoD for Trusted Advanced Packaging Capability Expansion with i3 Microsystems as Major Subcontractor read now March 24, 2021 Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System read now Look for i3 at these Trade Shows and Conferences October November
