News &
Events
News & Events
December 16, 2021
Kulicke & Soffa Collaborates with i3 Microsystems to Develop Solutions for Next-Generation Advanced Microelectronics Packaging
October 13, 2021
i3 Microsystems will be on a panel to discuss “Secure Heterogeneous Packaging” at the IEEE International PAINE 2021 conference.
May 20, 2021
i3 Microsystems discusses new technologies in Advanced Packaging with Semiconductor Engineering
March 30, 2021
Draper Awarded $14M by DoD for Trusted Advanced Packaging Capability Expansion with i3 Microsystems as Major Subcontractor
March 24, 2021
Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System
Look for i3 at these Trade Shows and Conferences
October
AUSA Annual Meeting and Exposition
54th International Symposium on Microelectronics (IMAPS 2021)
November
58th Annual AOC International Symposium & Convention
IEEE International Conferenceon PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)