Semiconductor Packaging
Semiconductor Packaging
- DMEA Category 1A Trusted Supplier for Packaging/Assembly
- Radiation Hardened Electronics Products
- Flip Chip, Wirebound, copper Pillar Bump Die, RDL & SMT on one package
- Heatspreader, Heatsink & Lid attach
- Multiple dispensing capabilities
- 3rd Party Substrate Partners or your AVL
![](https://y55b6f.p3cdn1.secureserver.net/wp-content/uploads/2020/04/1st_level-300x204.jpg)